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When you join TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set you up for long-term career success. Within this program, we also offer function-specific technical training and on-the-job learning opportunities that will encourage you to solve problems through a variety of hands-on, meaningful experiences from your very first day on the job.

TI's FAST (Field Applications & Sales Training) Program is designed to prepare Sales & Applications team members for customer-oriented careers that pair technical skills with business perspectives. The program provides experiences that help rising TIers understand how to successfully grow TI's business and to thrive throughout their entire TI career. There are two available FAST program tracks: (1) Field Applications and (2) Technical Sales.

Field Applications Engineer track

This 12-month experience aims to establish rising Field Applications Engineers (FAEs) as technical TI experts with customer engineers and internal teams. The track includes 3 rotations and an international headquarter experience:

Rotation 1, Field Sales Office (FSO): The FSO rotation is centered on learning how to work directly with customers to solve technical challenges, and to ultimately maximize TI's revenue by providing customers with the systems-level solutions that best address their design needs. Among other aspects, the FSO rotation focuses on analyzing technical trade-offs, understanding component selection, and solving design and cost challenges.

Rotation 2, Mass Market (MM): The MM rotation is designed to train FAEs on how to scale any action within a given sector or EE across multiple customers. Rotators will participate in innovative projects to help create new and more efficient sales processes. This rotation focuses on learning how to leverage TI’s resources, automation, practice scalable selling techniques, decision making in imperfect circumstances, and direct customer interactions.

Rotation 3, Business Unit/Systems Engineering & Marketing (BU/SEM): This rotation provides hands-on experiences that help future FAEs understand how various TI components fit together to provide systems-level solutions for customer designs. Rotators will be trained on business acumen, technical capabilities, and processes for new product definition and introduction. This rotation focuses on technical product selection, schematic/layout capture, PCB layouts, fabrication processes, board bring up and validation.

• Depending on your home country, this rotation would require a 3-month temporary relocation to either China, Germany, or India.

Headquarter Experience: The FAST program will conclude with a four-week “Headquarter Experience” at our global headquarters in Dallas, Texas. During this immersive experience, participants will build multi-level networks with key stakeholders and support functions, gain firsthand exposure to our Dallas campus, and learn how to effectively leverage the full range of company resources to drive future success.

Upon successful completion of the Field Applications Engineer track, rotators are welcomed as FAEs on TI's Worldwide Sales & Applications team. FAE responsibilities include:

• Using various sales tools and relationships with design engineering to identify all potential projects
• Providing customers with proactive proposals for complete, system-level solutions that maximize TI content
• Using broad technical expertise to influence customers' part selection process while favorably positioning TI versus competition

Texas Instruments will not sponsor job applicants for visas or work authorization for this position.

Minimum requirements:

• Bachelors degree in Electrical Engineering, Electronics Technology, Electrical Engineering Technology, Electrical and Computer Engineering or related field
• Fluent in local language and English, both written and oral communication skills
• Basic understanding of schematics, layouts and digital components
• Knowledge and understanding of analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)
• Experience with lab equipment, like oscilloscopes, along with soldering and debugging skills

• Core digital electronics fundamentals, processor and SoC architecture knowledge, embedded SW understanding (examples include: CPU architecture basics, Multi-core systems, Embedded OS basics: RTOS, Linux, bootloaders eg.)

  
  

Preferred qualifications:

• Experience with lab equipment such as oscilloscopes, along with soldering and debugging skills
• Programming skills in C/C++
• Demonstrated strong analytical and problem solving skills
• Excellent communication and presentation skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Ability to build lasting, influential relationships, both inside and outside the organization
• Ability to work effectively in a fast-paced and ever-changing environment
• Ability to take initiative and drive for results
• Ability to influence decisions through a sense of urgency and competitive drive

Additional preferred qualifications for Embedded Processing FAEs*:

• Solid understanding of embedded systems architecture and RTOS concepts:
  • Including memory management, interrupt handling, bootloaders, and peripheral interfaces (SPI, I2C, UART, etc.), as well as experience with ARM Cortex-M/A architectures.*
• Experience with wireless communication protocols and stacks:
  • Such as Bluetooth Low Energy (BLE), Ethernet, … including integration and troubleshooting in modules and SoCs.*
• Python scripting for automation and PC-based tools:
  • Useful for creating test scripts, automating workflows, and developing host-side utilities to support embedded development and evaluation.*
• Basic understanding of schematics with digital and analog circuitry (examples include: op-amps, DC/DC power, data converters, sensing, etc.)*